• Thermal properties meet high power demands of automotive applications.
  • Superior adhesion to substrate during thermal and mechanical stresses.
  • Shiny-side properties identical to those of thin copper foil.
  • Fine and uniform grain structure.
  • Controlled physical parameters limit bowing and twisting.
JTC400 with dendritic surface morphology

Overview
JTC400 is a 400 µm thick copper foil with electrolytically enhanced treatment. Because of its position as a leading supplier of electrodeposited copper foil, Gould is the first to optimize its production technology for such a foil. JTC400 enables the realization of circuitries with large cross sections on a small area making it ideal for high power automotive applications.

Prior to the introduction of JTC400, the development of new applications was limited to etching and punching technologies for rolled copper on single- or double-sided paper or composite laminates. With JTC400, new applications that require higher performance in severe environments are now possible. Future products that must withstand temperatures of up to +150° C and temperature cycles of –40 to 140° C require printed circuits on suitable substrates such as FR-4 epoxy systems, high Tg resins or polyimides. Laminated to JTC400 with its dendritic surface morphology, the risk of track cracking or delamination due to extreme temperatures can effectively be eliminated.

Fully electrodeposited 400 µm thickness
Designers for high power applications in the automotive industry, in particular, will realize the benefits of the thermal properties of JTC400. Electrical and electronic components for convenience products are on the rise within this industry. Many such applications including power distribution, fuse boxes, seat adjustment, seat heating and others demand high currents. JTC400 offers new opportunities to designers and engineers of these applications.

Advantages

  • High Bond Strength – The dendritic base structure and approved JTC™ treatment ensures a strong bond with the substrate during thermal and mechanical processing stresses.
  • Thin Foil Shiny-Side Properties – Because JTC400 has the same shiny-side properties as thin copper foil, similar processing techniques in etching and photo-imaging can be applied.
  • Excellent Etching Characteristics – The fine and uniform grain structure guarantees excellent etching characteristics such as etchability with reduced undercut.
  • Limits Bowing and Twisting – The tendency to bow and twist is limited by controlled physical parameters like tensile strength, thermal stability and reduced internal stress.

Specifications
JTC400 is available as sheets in sizes of up to 1300 x 2800 mm2. It is manufactured with the same high quality and short lead times as Gould’s thin JTC copper foil. The physical characteristics of JTC400 meet all requirements of the international standard IPC-4562.

Typical Properties
Property JTC400
Thickness (µm) 400
Area weight
• oz/ft2
• g/m2		 11.5
3550
Tensile strength @ room temp.
• n/mm2
• KPSI		 300
43
Elongation (%) @ room temp. 17
Roughness Rz (µm) 15

Other thick foils from 140 µm to 350 µm are also readily available.