Below is a list of our most recent news releases.
You can view past news by going to our news archives.

03/13/07—Sweepstakes Using Gould Name is a Scam—Gould Electronics urges consumers to disregard a mail sweepstakes scam that has surfaced nationwide and is fraudulently using the Gould name.Read the Release>>

11/02/06—Gould to Update Website—The Gould website is currently being updated. Contact ggrossmann@gould.de with any questions about our products or services.Read the Release>>

06/13/06—Nippon Mining & Metals Licenses TCR Product to Ticer Technologies—Nippon Mining & Metals Co., Ltd. announced it has licensed the technology and trademark for its Gould Electronics Inc. subsidiary’s TCR® embedded resistor product to Ticer Technologies, L.L.C.Read the Release>>

02/06/06—Nikko Materials to License TCR Product to Gould Management Group—Nikko Materials Company, Ltd. announced it will license technology for its TCR embedded resistor product to a management group from its Gould Electronics subsidiary. The group is headed by David P. Burgess, current president of Gould Electronics.Read the Release>>

12/21/05—Gould Plans to Close U.S. Operations—Copper foil manufacturer Gould Electronics, a subsidiary of Nikko Materials Co., Ltd., a unit of Nippon Mining Holdings, Inc., today announced that it plans to close its Chandler, Arizona, manufacturing facility and U.S. headquarters by April of 2006.Read the Release>>

04/14/05—Nikko Materials USA, Inc. Announces Completion of Its Business Consolidation and Assignment of New Corporate Officers—Nikko Materials USA, Inc. today announced the consolidation of U.S. manufacturing, administration and research and development at its Chandler, Arizona location will be completed May 1, 2005. Read the Release>>

03/03/05—Gould R&D VP Clouser Recognized by ECWC 10—Gould Electronics Inc. Vice President of Research & Development Sidney Clouser and three collaborators earned an honorable mention from the Electronic Circuits World Convention 10 Program Committee for their technical paper titled “Non-Classical Conductor Losses due to Copper Foil Roughness.” The paper was presented at the Printed Board Design & Performance Meeting on February 23, 2005. Read the Release>>

01/26/05—Gould to Exhibit at IPC Expo—Gould Electronics Inc. announced today that it will exhibit at booth 1401 at the IPC Printed Circuits Expo, which takes place February 22-24 at the Anaheim Convention Center in Anaheim, CA. Read the Release>>

06/22/04—Gould Announces Sale of Fiber Optics Unit—Gould Electronics said that it has sold its Fiber Optics unit to Applied Fiber, Inc. of Albany, GA. Based in Millersville, MD, Gould Fiber Optics produces fiber optic couplers with value-added assemblies. Read the Release>>

02/19/04—Gould Positions TCR Resistor Foil for Mainstream PCB Market—Gould Electronics Inc. today announced it is positioning its TCR resistor foil for the mainstream printed circuit board market by making it more affordable and widely available for manufacturers and laminators. Read the Release>>

02/10/04—Gould Announces Copper Foil Price Increases—Gould Electronics Inc. today announced that it is increasing prices on all of its copper foil products. Read the Release>>

09/10/03—Gould to Feature Three Foils at Productronica—Gould Electronics Inc. announced today that it will feature three copper foils at Productronica, the electronics manufacturing industry’s largest trade show. Read the Release>>

08/01/03—Restructuring to Improve Gould Financial Strength—Gould Electronics Inc. said today that it will gain financial strength and flexibility as a result of a restructuring by its Japan-based parent company, Nippon Mining Holdings, Inc. and its three primary business groups - Nikko Metals, Japan Energy Co. and Nikko Materials Co., Ltd. Read the Release>>

03/25/03—Gould Presents Three Papers at IPC Printed Circuits Expo—Gould Electronics Inc. announced today that it will present three technical papers at the IPC Printed Circuits Expo. Read the Release>>

02/20/03—Gould to Consolidate U.S. Copper Foil Manufacturing—Gould Electronics Inc. said today that all of its U.S. copper foil manufacturing will be consolidated at the company's Chandler, AZ facility by the end of the third quarter of 2003. Read the Release>>

01/15/03—Gould to Consolidate U.S. CAC Manufacturing—Gould Electronics Inc. said today that it will consolidate all of its U.S. CAC (copper aluminum copper) manufacturing at the company's Chandler, AZ facility. Further, the company said that it will begin negotiations with the International Association of Machinists concerning the possible closing of its McConnelsville, OH copper foil manufacturing facility and the potential consolidation of U.S. foil production at Chandler. Read the Release>>