Gould Electronics is a worldwide leader in the production of printed circuit materials including JTC™ electrodeposited copper foil, CAC^® (Copper-Aluminum-Copper) foil and TCR^® resistor foil.

The company pioneered the use of copper foil in printed circuit board applications in 1957, when it invented an electroplating process that resulted in a high purity copper foil that could be successfully used in printed circuit applications without circuit disruptions caused by lead impurities. Founded in the late 1800s, Gould today provides outstanding products, service and innovation to the printed circuit board industry.

Gould meets the unique needs of printed circuit board manufacturers and laminators by featuring a global approach to sales, marketing, new product development, manufacturing and distribution.  Headquartered in Chandler, Arizona, USA, the company operates facilities in North America and Europe. It goes to market in Asia under the GNF brand with products manufactured by Nikko Materials Company, Ltd.

Gould’s product offerings include:

• Conventional Copper Foils
• Advanced Interconnect Foils
• CAC^® (Copper Aluminum Copper) and Aluminum Products
• Specialty Application Foils
• Flex Circuit Foils

Gould manufacturing facilities are certified worldwide to the ISO 9001 specification, which assures customers that we understand their requirements and have quality systems in place to guarantee that specifications are met.