• Superior performance and reliability.
• Standard profile for rigid, composite and conventional multilayer/mass lamination applications.
• Low profile for fine line circuitry.

Overview
JTC or Grade 1 copper is a multipurpose foil commonly used for rigid, composite and mass lamination applications. Foil thicknesses, which range from 9 µm (0.25 oz) to 350 µm (10 oz), are available and conform to the requirements of the latest revision of IPC-4562. Matte side profile can be standard (rough) or low (near smooth) in order to satisfy user’s requirements of conductor line adhesion, fine line etching, and dielectric spacing for controlled impedance circuit boards.

As the density of multilayer packages increases, registration and dimensional stability in the XY direction become paramount. Low profile JTC foil minimizes stresses during lamination, thereby increasing dimensional stability of thin laminates used in multilayer packages.

Advantages
The JTC treatment is the result of multiple electrochemical processes that:

• Allow for Automated Optical Inspection – Unblemished JTC foil surfaces permit both reflective and fluorescent automated optical inspection of laminated and printed circuit board products by minimizing any apparent visual changes of foil surfaces following lamination and PWB processing.
• Chemically Bond Foil to Various Prepregs – Proprietary silanes ensure foil-to-resin adhesion during processing.
• Stabilize the Copper Foil Surface to Prevent Oxidation – The stabilizer (passivation) avoids discoloration or oxidation during lamination and postbaking, and minimizes laminate staining reactions with curing agents. Additionally it facilitates chemical and mechanical cleaning.
• Provide a Barrier Layer to Minimize Bond Degradation – The brass barrier layer retards the thermally and chemically induced degradation of foil adhesion often associated with alternative treatments.

• Increase Surface Area for Adhesion – Copper nodules are plated on the matte surface in order to increase surface area and maximize adhesion by interlocking with a variety of different resin systems. When tested on typical epoxy and multifunctional prepregs, in accordance with IPC testing requirements, JTC foil passes all tests, including high temperature peel, solder shock and accelerated aging.

Specifications
The combination of all Gould proprietary processes provides the industry with a foil that exceeds the requirements of all industrial specifications. Results from customer and internal tests are outlined in the table below.