Gould’s history of technological innovation stems back to 1957, when the company began production of electrodeposited copper foil by drawing on its vast experience in electroplating. As the global demand for copper foil has grown, so has Gould, which is well equipped to continue leading the development of new and improved materials to serve the PCB industry.

Research and development has played an important role in the company’s development since its origins. Behind our aggressive R&D program, Gould has:

• Developed an outstanding patent portfolio
• Become a thought leader in the industry as demonstrated by regularly published technical papers
• Made a commitment to continuous quality improvement in our products and services and is ISO 9001 certified at all facilities around the world.

These initiatives continue today with customer-driven research that focuses on creating new products, process improvements and product variations. The continuing research in electrochemistry, metallurgy and all copper foil related disciplines makes Gould the leading supplier of technologically advanced products required for the electronics industry.