Gould Electronics Inc. - White Papers

Gould researchers and engineers, behind their decades of experience, are looked upon as thought leaders in the industry. The following are recent technical papers published by Gould associates.

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Year Published	Title and Author
2005	Non-Classical Conductor Losses due to Copper Foil Roughness and Treatment Brist, G.; Hall, S.; Clouser, S. and Liang, T.

2004	Adhesion and Etching of Nickel-Chromium Tiecoat on Adhesiveless Flexible Laminate Bergstresser, T.; Hilburn, R. and Wang, J.

2003	Adhesiveless Copper on Polyimide Substrate with Nickel-Chromium Tiecoat Bergstresser, T.; Hilburn, R.; Kaplan, H. and Le, R.
	Embedded Capacitance Materials and Their Application in High Speed Designs Bergstresser, T. and Hilburn, R. (Gould Electronics); Obrzut, J. (NIST) and Phillips, K.
	Power Dissipation of Embedded Resistors Wang, J.; Davis, M.; Hilburn, R. and Clouser, S.
	Stress Effects on Thin Film Nichrome Embedded Resistor Tolerance Wang, J.; Hilburn, R. and Clouser, S.

2002	Manufacturing Embedded Resistors Wang, J.; Hilburn, R.; Clouser, S. and Greenlee, B.

2001	Copper Foil Treatment for CO^₂ Laser Direct Drilling Clouser, S.J. and Sakamoto, M.
	CTE of Thin Copper Foils for Electronic Laminate Structures Zimprich, P.; Wottle, I.; Merchant, H.D.; Wiechmann, R.; Zagar, B. and Weiss, B.
	Strain Controlled Mechanical Fatigue of Thin Copper Foil and Flexible Circuit Merchant, H.D. and Mahnke, D.B.
	Thermo-mechanical Response of Cu Foils for Microsystems Khatibi, G.; Groger, V.; Merchant, H.D.; Weiss, B. and Wiechmann, R.
	Thermoelastic Performance of Copper Foil and Cu/FR-4 and Cu/PI Laminates Khatibi, G.; Klein, M.; El-Magd, E.; Merchant, H.D.; Weiss B.; Wiechmann, R. and Zimprich, P.
	Thin Film Embedded Resistors Wang, J.T. and Clouser, S.J.

2000	Copper on Polyimide Flexible Substrate For Ultra-Thin, High Performance Applications Bergstresser, T.R. and Sallo, J.S.
2000	Metallurgy and Performance of Electrodeposited Copper for Flexible Circuits Merchant, H.D.; Wang, J.T.; Giannuzzi, L.A. and Liu, Y.L.

1999	Adhesiveless Copper on Polyimide for Flexible Circuit, HDI and Microvia Applications Bergstresser, T.R. and Sallo, J.S.
	Adhesiveless Polyimide Laminate Substrates for Flexible Circuit Applications Bergstresser, T.R. and Sallo, J.S.
	Hydraulic Bulge Test of Electrodeposited Copper Foil Merchant, H.D. and Rozboril, M.G.
	Mechanical Fatigue of Thin Copper Foil Merchant, H.D.; Minor, M.G. and Liu, Y.L.
	Thermal Softening of Thin Copper Foil Merchant, H.D. and Minor, M.G.

1998	18 µm Electrodeposited Copper Foil for Flex Fatigue Applications Merchant, H.D.; Minor, M.G.; Clouser, S.J. and Leonard, D.T.
	Accelerated Humidity Durability Testing of Adhesiveless Polyimide Laminates Bergstresser, T.R.; Bergkessel, N.E. and Poutasse, C.A.
	Bendability of Thin Copper Foil Merchant, H.D.; Minor, M.G. and Rozboril, M.G.
	Damage in Copper Foil Based Flexible Circuit During Mechanical Fatigue Merchant, H.D.; Minor, M.G. and Rozboril, M.G.
	Effects of Moisture on Peel Strength of Adhesiveless Polyimide Laminates Bergstresser, T.R.; Bergkessel, N.E.; Chiang, S.K. and Poutasse, C.A.
	Fatigue Life Statistics for 18 µm Foil Based Flexible Circuits Merchant, H.D.; Mahnke, D.B.; Leonard, D.T. and Clouser, S.J.
	Grain Structure of 15 µm Copper Plateup on Polyimide Merchant, H.D.

1997	Adhesion Performance of Polyimide Adhesiveless Flexible Laminates Having Nickel Based Tiecoats Bergkessel, N.E.; Bergstresser, T.R.; Chiang, S.K. and Russell, D.B.
	Characterization of Damage During Flex Fatigue of 18 µm Copper Foil Merchant, H.D.; Minor, M.G. and Rozboril, M.G.
	Defect Structure and Crystallographic Texture of Polycrystalline Electrodeposits Merchant, H.D. and Girin, O.B.
	Peel Strength of Adhesiveless Polyimide Laminates After Thermal and Chemical Exposure Bergstresser, T.R.; Bergkessel, N.E.; Chiang, S.K.; Poutasse, C.A. and Russell, D.B.
	Stress Relaxation and Creep of 12 to 35 µm Copper Foil Merchant, H.D.

1996	Effect of Thermal Exposure on Flex and Fold Fatigue Performance of Fine Grained Electrodeposited Copper Foil Merchant, H.D. and Clouser, S.J.
	Flex Fatigue of Adhesiveless Copper Plateup on Polyimide Merchant, H.D.; Chiang, S.K. and Minor, M.G.
	Fold Fatigue Performance of 18 µm Copper Foil Merchant, H.D.; Clouser, S.J. and Minor, M.G.

1995	Defect Structure of Electrodeposits Merchant, H.D.
	Surface Morphology of Electrodeposits Bergstresser, T.R. and Merchant, H.D.
	Thermal Response of Electrodeposited Copper Merchant, H.D.
	Through-Thickness Characterization of Copper Electrodeposit DeAngelis, R.J.; Knorr, D.B. and Merchant, H.D.

1993	Annealing Kinetics and Embrittlement of Electrodeposited Copper Merchant, H.D.