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- Higher profile and higher nodularization increase mechanical adhesion.
- Specialty silanes on foil increase chemical bonding to high performance resin systems.
- Tailored to enhance adhesion to specialty resins.
Overview
JTCHP • JTCSHP
Hi-Performance JTC (Grade 1) and JTCS (Grade 3) foils are specially treated to bond to high performance, high Tg resin systems. When compared to standard JTC foil, Hi-Performance JTC is manufactured with higher base foil profile and more nodularization, both designed to increase mechanical adhesion and peel strength. Hi-Performance JTC and JTCS products are also treated with a silane tailored to react with and chemically bond to high Tg resin systems such as polyimide, BT, polyester and cyanate ester. The silane not only increases peel strength, but also enhances copper-to-resin adhesion and PWB reliability.
JTCAB • JTCSAB
Grade 1 and Grade 3 Advanced Bond foils are offered for laminates made with pure, non-MDA polyimide resins under the names JTCAB and JTCSAB. Advanced Bond foils are treated with a special silane that bonds with non-MDA polyimide resin, thereby increasing peel strength.
Advantages
- Higher Peel Strength – Hi-Performance foils are designed to increase mechanical and chemical adhesion to a variety of specialty resin systems, especially high Tg types.
- Improved Laminate and PWB Reliability – Silane chemically bonds copper foil to resin systems, thereby increasing resistance to delamination and pad lifting.
- Higher profile and higher nodularization increase mechanical adhesion.
- Specialty silanes on Advanced Bond foil increase chemical bonding and peel strength on laminates made with non-MDA polyimide resin.
Specifications
JTCHP • JTCSHP
HP treated copper foils are available in a variety of widths and thicknesses ranging from 12 µm (0.375 oz) to 350 µm (10 oz). Double treated versions of Hi-Performance foils are manufactured in thicknesses of 18 µm (0.5 oz) to a maximum of 140 µm (4 oz) for JTC and 18 µm (0.5 oz) to a maximum of 70 µm (2 oz) for JTCS.
Below is a listing of typical peel improvements obtained with Hi-Performance foils when laminated to various specialty resin systems.
| Typical Peel Strength Using 35 µm (1 oz) Foil |
| Resin System |
JTC Grade 1 |
Hi-Performance JTC Grade 1 |
| n/mm |
lb/in |
n/mm |
lb/in |
| Polyimide |
1.31 |
7.5 |
1.58 |
9.0 |
| Polyester |
1.05 |
6.0 |
1.40 |
8.0 |
| BT |
1.40 |
8.0 |
1.75 |
10.0 |
| Cyanate ester |
1.14 |
6.5 |
1.49 |
8.5 |
JTCAB • JTCSAB
Advanced Bond and Advanced Bond Double Treated foils are provided in thicknesses of 18 µm (0.5 oz), 35 µm (1 oz), and 70 µm (2 oz).
| Hi-Performance JTCS |
Enhanced Resin Adhesion,
Advanced Bond JTCS |
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Copper Foil Peelbacks (2000x) on Non-MDA Polyimide Resin |
| 1.23 n/mm (7.0 lb/in) |
1.66 n/mm (9.5 lb/in) |
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Specialty silane used during manufacture of Advanced Bond products chemically bonds to non-MDA polyimide resin, thus increasing peel strength.
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Hi-Performance JTC (Grade 1)
JTC (Grade 1)
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